IMAGING DEVICE AND MANUFACTURING METHOD FOR SAME

Title:

IMAGING DEVICE AND MANUFACTURING METHOD FOR SAME

Document Type and Number:

WIPO Patent Application WO/2013/084529

Kind Code:

A1

Abstract:

An imaging device (1) is provided with a light receiving element unit (2), a processing unit (3), a first connection body (4) and a second connection body (5). The first connection body (4) electrically connects: a first electrode (11) of the light receiving element unit (2); and a second electrode (21) that corresponds to the processing unit (3). The first connection body (4) contains: an indium-containing solder portion (29) placed between the first electrode (11) and the second electrode (21); and a barrier layer (30) for reducing alloying of the first electrode (11) and the second electrode (21) with the solder portion (29). The second connection body (5) has a melting point at least as high as the melting point of the first connection body, and contains an alloy portion (33) formed by alloying with solder containing a material of greater hardness than the first connection body.

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Inventors:

MORI HIROKI (JP)
MIGITA MASAKI (JP)
NAGAI YOUICHI (JP)

Application Number:

PCT/JP2012/067320

Publication Date:

June 13, 2013

Filing Date:

July 06, 2012

Export Citation:

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Assignee:

SUMITOMO ELECTRIC INDUSTRIES (JP)
MORI HIROKI (JP)
MIGITA MASAKI (JP)
NAGAI YOUICHI (JP)

International Classes:

H01L27/146; H01L21/60; H01L25/16; H01L27/144

Domestic Patent References:

WO2006123554A1

2006-11-23

Foreign References:

JP2010157667A	2010-07-15
JPH08148495A	1996-06-07
JP2011171554A	2011-09-01
JP2006278884A	2006-10-12
JPH06232203A	1994-08-19

Other References: