IMAGING DEVICE, METHOD FOR MANUFACTURING IMAGING DEVICE, AND ELECTRONIC APPARATUS

Title:

IMAGING DEVICE, METHOD FOR MANUFACTURING IMAGING DEVICE, AND ELECTRONIC APPARATUS

Document Type and Number:

WIPO Patent Application WO/2022/097427

Kind Code:

A1

Abstract:

Provided is an imaging device (1) comprising: a first semiconductor substrate (100) provided with a photoelectric conversion element; a second semiconductor substrate (200) which is stacked on the first semiconductor substrate with an inter-layer insulating film (123) therebetween, and is provided with a pixel circuit that reads charges generated at the photoelectric conversion element as a pixel signal; and a via (600) which passes through the inter-layer insulating film and electrically connects at least a part of a first surface of the first semiconductor substrate facing the second semiconductor substrate and a second surface of the second semiconductor substrate, the second surface facing the first surface.

Inventors:

MOCHIZUKI TAKEYA (JP)
NAKAZAWA KEIICHI (JP)
YOSHIDA SHINICHI (JP)
NISHIO KENYA (JP)
FUJII NOBUTOSHI (JP)
SAITO SUGURU (JP)
OKAMOTO MASAKI (JP)
KAMATANI RYOSUKE (JP)
YAMAMOTO YUICHI (JP)
IZUKASHI KAZUTAKA (JP)
MIYANAMI YUKI (JP)
YOSHIOKA HIROTAKA (JP)
HORIKOSHI HIROSHI (JP)
KUROTORI TAKUYA (JP)
FURUSE SHUNSUKE (JP)
HONDA TAKAYOSHI (JP)

Application Number:

PCT/JP2021/037502

Publication Date:

May 12, 2022

Filing Date:

October 11, 2021

Export Citation:

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Assignee:

SONY SEMICONDUCTOR SOLUTIONS CORP (JP)

International Classes:

H01L21/3205; H01L21/768; H01L23/522; H01L27/146; H04N5/369

Domestic Patent References:

WO2018186197A1	2018-10-11
WO2016009943A1	2016-01-21
WO2019131965A1	2019-07-04

Foreign References:

JP2018129412A

2018-08-16

Other References: