Title:
IMAGING DEVICE, METHOD FOR MANUFACTURING IMAGING DEVICE, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/209365
Kind Code:
A1
Abstract:
Provided is an imaging device (1) comprising a semiconductor substrate (10) and a plurality of imaging elements (100) which are arranged in a matrix along a row direction and a column direction on the semiconductor substrate, and which perform photoelectric conversion of incident light, wherein the imaging elements each have: a plurality of pixels (300) which are provided adjacently to each other in the semiconductor substrate; an element partitioning wall (310) which is provided so as to surround the plurality of pixels and pass through the semiconductor substrate; an on-chip lens (200) which is provided above a first surface of the semiconductor substrate so as to be shared by the plurality of pixels; and a first pixel partitioning part (304) which partitions the plurality of pixels.
Inventors:
HONDA TAKAYOSHI (JP)
SHIOYAMA TADAMASA (JP)
SHIOYAMA TADAMASA (JP)
Application Number:
PCT/JP2022/005777
Publication Date:
October 06, 2022
Filing Date:
February 15, 2022
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H01L21/76; H01L21/762; H04N5/369
Domestic Patent References:
| WO2020013130A1 | 2020-01-16 | |||
| WO2020095689A1 | 2020-05-14 |
Foreign References:
| JP2020068289A | 2020-04-30 | |||
| JP2017212351A | 2017-11-30 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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