Title:
SOLID STATE IMAGING ELEMENT AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/209366
Kind Code:
A1
Abstract:
This solid state imaging element (1) comprises a plurality of light-receiving pixels (11) arranged in a matrix shape inside a semiconductor layer (20). In addition, the light-receiving pixels (11) have a pair of photoelectric converting units, a first separation region (24), a second separation region (25), and a third separation region (26). The pair of photoelectric converting units are disposed adjacent to each other. The first separation region (24) is disposed so as to surround the pair of photoelectric converting units and is provided so as to pass through the semiconductor layer (20). The second separation region (25) is disposed between the pair of photoelectric converting units and is provided so as to pass through the semiconductor layer (20). The third separation region (26) is disposed in the region surrounded by the first separation region (24) and is provided midway between a light incident surface (20a) of the semiconductor layer (20) and the semiconductor layer (20).
Inventors:
NISHIDA KEIJI (JP)
SEKIGUCHI KOJI (JP)
SEKIGUCHI KOJI (JP)
Application Number:
PCT/JP2022/005787
Publication Date:
October 06, 2022
Filing Date:
February 15, 2022
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H04N5/369
Foreign References:
| US20170170216A1 | 2017-06-15 | |||
| JP2017212351A | 2017-11-30 | |||
| US20180047766A1 | 2018-02-15 | |||
| JP2018201015A | 2018-12-20 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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