Title:
IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/090384
Kind Code:
A1
Abstract:
Provided is an imaging device (1), comprising: an imaging element (10); and a semiconductor element (20, 30) that is provided so as to oppose the imaging element and is electrically connected to the imaging element. The semiconductor element includes: a wiring region (20A, 30A) provided in the center thereof and a peripheral region (20B, 30B) outside of the wiring region; a wiring layer (22, 32) having wiring in the wiring region; a semiconductor substrate (21, 31) that opposes the imaging element with the wiring layer interposed therebetween and that has a first surface (Sa, Sc) and a second surface (Sb, Sd) which are provided in this order from the wiring layer side; and a polishing adjustment portion (23, 33) that is made of a material having a lower polishing rate than the constituent material of the semiconductor substrate, that is disposed in at least a portion of the peripheral region, and that is provided in the semiconductor substrate in the thickness direction thereof from the second surface.
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Inventors:
SAITO SOTETSU (JP)
SAITO SUGURU (JP)
FUJII NOBUTOSHI (JP)
SAITO SUGURU (JP)
FUJII NOBUTOSHI (JP)
Application Number:
PCT/JP2019/039744
Publication Date:
May 07, 2020
Filing Date:
October 09, 2019
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H01L21/304
Foreign References:
| JP2013214616A | 2013-10-17 | |||
| US20140268609A1 | 2014-09-18 | |||
| JP2016058655A | 2016-04-21 | |||
| JPH09106968A | 1997-04-22 |
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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