Title:
IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/018934
Kind Code:
A1
Abstract:
Provided is an imaging device capable of suppressing the generation of scattered light. The imaging device comprises: a semiconductor substrate having a first surface onto which light falls and a second surface located on the opposite side of the first surface; a plurality of pixels provided on the semiconductor substrate and performing photoelectric conversion on the light; a pixel separation section provided on the semiconductor substrate and separating one pixel and another pixel, which are adjacent to each other, among the plurality of pixels; and a first protrusion that is provided on the semiconductor substrate and protrudes from the pixel separation portion to the inside of the pixel. The first tip of the first protrusion has a first portion located on the first surface side. The first portion has a material or structure that absorbs light to a greater degree than the pixel separation portion.
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Inventors:
ZAITSU KOICHIRO (JP)
MATSUMOTO AKIRA (JP)
MATSUMOTO AKIRA (JP)
Application Number:
PCT/JP2023/025329
Publication Date:
January 25, 2024
Filing Date:
July 07, 2023
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146
Domestic Patent References:
WO2021193915A1 | 2021-09-30 | |||
WO2021111904A1 | 2021-06-10 | |||
WO2018221443A1 | 2018-12-06 | |||
WO2021193254A1 | 2021-09-30 |
Foreign References:
US20200243578A1 | 2020-07-30 | |||
JP2017220724A | 2017-12-14 |
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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