Title:
IMAGING ELEMENT, IMAGING DEVICE, AND METHOD FOR MANUFACTURING IMAGING ELEMENT
Document Type and Number:
WIPO Patent Application WO/2022/239345
Kind Code:
A1
Abstract:
The imaging element in one aspect according to the present disclosure comprises: a light-receiving chip (201) that is one example of a light-receiving substrate having a photoelectric conversion element (311) and an N-type transistor (312), which is one example of a first element electrically connected to the photoelectric conversion element (311); a detection chip (202) that is one example of a detection substrate having a plurality of elements that are electrically connected to the light-receiving chip (201) and that are included in an event detection unit for outputting an event signal in accordance with a change in the current outputted from the photoelectric conversion element (311); and a supply unit (313) that imparts, to a node of the photoelectric conversion element (311) or to a node of the N-type transistor (312), an electrical potential for deactivating an operation of the photoelectric conversion element (311) or the N-type transistor (312).
Inventors:
OTANI TAKEHIRO (JP)
SHIBATA TOMOHIKO (JP)
MATSUKI TAKERU (JP)
KITANO SHIN (JP)
OZAWA YUKI (JP)
SHIBATA TOMOHIKO (JP)
MATSUKI TAKERU (JP)
KITANO SHIN (JP)
OZAWA YUKI (JP)
Application Number:
PCT/JP2022/006008
Publication Date:
November 17, 2022
Filing Date:
February 15, 2022
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H04N5/3745; H04N5/367
Domestic Patent References:
| WO2019187684A1 | 2019-10-03 |
Foreign References:
| JP2020088723A | 2020-06-04 | |||
| JPH10284707A | 1998-10-23 | |||
| JPH08129046A | 1996-05-21 | |||
| JP2020053827A | 2020-04-02 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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