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Title:
IMPRINT MOLD
Document Type and Number:
WIPO Patent Application WO/2016/103653
Kind Code:
A1
Abstract:
[Problem] To provide an imprint mold used upon being wrapped around a roll, wherein a concavo-convex pattern formation region of an electroformed mold can be effectively utilized. [Solution] An imprint mold (10), comprising a disc-shaped electroformed mold body (1) having a concavo-convex pattern (2) formed on the surface, and an extension part (3) integrated with the electroformed mold body (1) so as to extend around the electroformed mold body (1).

Inventors:
UMEZAWA TOMOKAZU (JP)
Application Number:
PCT/JP2015/006285
Publication Date:
June 30, 2016
Filing Date:
December 17, 2015
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
H01L21/027; B29C33/38; B29C59/02; B29C59/04
Domestic Patent References:
WO2014136731A12014-09-12
WO2013031460A12013-03-07
Foreign References:
JP2009223310A2009-10-01
JP2012109487A2012-06-07
JPH08190739A1996-07-23
JP2003509228A2003-03-11
US20140314897A12014-10-23
JP2001035021A2001-02-09
JP2007305945A2007-11-22
JP2010537843A2010-12-09
JP2006339644A2006-12-14
Attorney, Agent or Firm:
YANAGIDA, Masashi et al. (JP)
Seiji Yanagida (JP)
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