Title:
IMPROVED AUTODEPOSITION METAL DIP COATING PROCESS
Document Type and Number:
WIPO Patent Application WO2003020447
Kind Code:
A3
Abstract:
What is disclosed is a no-rinse autodeposition process to dip-apply a metal part in an aqueous resin coating bath with an immersion time and, wherein the removal rate of the dipped part is kept equal or below drainage rate of mobile liquid portion, such that upon removal of the part, drip edge formation is formation in minimized and a DFT is maintained within acceptable tolerance levels.
Inventors:
WILLIAMS JAMES B
WEIH MARK A
REARICK BRETT A
WEIH MARK A
REARICK BRETT A
Application Number:
PCT/US2002/027896
Publication Date:
November 13, 2003
Filing Date:
August 30, 2002
Export Citation:
Assignee:
LORD CORP (US)
International Classes:
B05D7/14; C09D5/08; (IPC1-7): B05D7/14
Domestic Patent References:
| WO1999037722A1 | 1999-07-29 |
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