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Patent Searching and Data


Title:
IN-LINE DUMPLING MOLDING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2022/186600
Kind Code:
A1
Abstract:
An in-line dumpling molding system is disclosed. The in-line dumpling molding system according to the present invention comprises: a dumpling wrapper cutting device, which cuts a supplied dough sheet to form dumpling wrappers; a dumpling-molding lower folding device, which is disposed below the dumpling wrapper cutting device, on which the cut dumpling wrappers are loaded, and which presses and folds the dumpling wrappers onto which dumpling fillings have been supplied; and a sealing device, which is disposed above the dumpling-molding lower folding device, and presses and seals the folded dumpling wrappers.

Inventors:
JANG BONG JIN (KR)
KIM SE JIN (KR)
JUNG DA WOON (KR)
BAE SOON SUK (KR)
KIM SANG CHEOL (KR)
LEE YONG GYU (KR)
Application Number:
PCT/KR2022/002942
Publication Date:
September 09, 2022
Filing Date:
March 02, 2022
Export Citation:
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Assignee:
CJ CHEILJEDANG CORP (KR)
International Classes:
A23P20/20; A21C11/00; A21C11/10; A21C11/16; A23P30/20
Foreign References:
KR20160099796A2016-08-23
KR102073611B12020-02-06
KR20200125435A2020-11-04
CN106305880B2020-10-30
CN105360196B2018-08-31
Attorney, Agent or Firm:
KWON, Young Kyu (KR)
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