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Title:
INFRARED ABSORPTION COMPOSITION AND INFRARED ABSORPTION COMPOSITION KIT; INFRARED CUT-OFF FILTER USING SAME AND MANUFACTURING METHOD THEREOF; AND CAMERA MODULE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2014/126192
Kind Code:
A1
Abstract:
An infrared absorption composition and infrared absorption composition kit enabling manufacture of an infrared cut-off filter with excellent near-infrared shielding, infrared shielding and heat resistance and moisture resistance; an infrared cut-off filter using the same and a manufacturing method thereof; and a camera module and a manufacturing method thereof are provided. This infrared absorption composition kit includes a composition containing a copper compound or a pigment having a maximum absorption wavelength in the wavelength range of 700nm-1000nm, and a composition containing a metal oxide having a maximum absorption wavelength in the wavelength range of 800nm-2000nm.

Inventors:
BAK SEONGMU (JP)
EZOE TOSHIHIDE (JP)
SHIMADA KAZUTO (JP)
Application Number:
PCT/JP2014/053449
Publication Date:
August 21, 2014
Filing Date:
February 14, 2014
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C09K3/00; C09B67/20; H04N5/225; H04N5/369; H04N9/07
Domestic Patent References:
WO2011071052A12011-06-16
WO2004006336A12004-01-15
Foreign References:
JP2012021066A2012-02-02
JP2012020448A2012-02-02
JP2010079145A2010-04-08
JP2013241563A2013-12-05
JP2012229388A2012-11-22
JP2008200924A2008-09-04
JP2011503274A2011-01-27
JP2008091535A2008-04-17
JP2001154015A2001-06-08
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
Mochitoshi Watanabe (JP)
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