Title:
INFRARED TEMPERATURE SENSOR AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/166587
Kind Code:
A1
Abstract:
Embodiments of the present application provide an infrared temperature sensor and an electronic device. The infrared temperature sensor comprises a substrate, an infrared light sensing assembly, and a package; the infrared light sensing assembly is disposed on the substrate; the infrared light sensing assembly comprises a thermopile sensing element and a filter; the filter is attached to the thermopile sensing element; the package covers the substrate and wraps the infrared light sensing assembly; the package is provided with a light entrance area; and the light entrance area is aligned with the infrared light sensing assembly. In the infrared temperature sensor provided by the embodiments of the present application, the infrared light sensing assembly is encapsulated by the package, such that the thermopile sensing element can be protected, without affecting light transmission, thereby lowering the processing difficulty and reducing the size of the infrared temperature sensor.
Inventors:
ZHOU FEIYUN (CN)
Application Number:
PCT/CN2022/072797
Publication Date:
August 11, 2022
Filing Date:
January 19, 2022
Export Citation:
Assignee:
HEFEI CHIPSEA ELECTRONICS TECH CO LTD (CN)
International Classes:
G01J5/12; G01J5/02
Foreign References:
| CN214621493U | 2021-11-05 | |||
| TWM607216U | 2021-02-01 | |||
| CN104409624A | 2015-03-11 | |||
| CN110146176A | 2019-08-20 | |||
| CN207798270U | 2018-08-31 | |||
| CN212458679U | 2021-02-02 | |||
| CN106932104A | 2017-07-07 |
Attorney, Agent or Firm:
SHENZHEN ZHIQUAN INTELLECTUAL PROPERTY OFFICE (CN)
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