CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE

WIPO Patent Application WO/2022/166588

A1

Provided in the present application is a circuit board assembly, comprising a circuit board, an electronic device and/or signal lines, wherein a plurality of bonding pads and at least one isolation groove are formed on the circuit board; the electronic device comprises at least two pins, and each pin is welded to the bonding pad; the signal lines at least comprise a first conductor and a second conductor, and the first conductor and the second conductor are each welded to the bonding pad; and the isolation groove is arranged between at least two bonding pads, so as to electrically isolate the at least two bonding pads. By means of the embodiments of the present application, an isolation groove is provided on a circuit board, a solder flux is prevented from directly accumulating on the surface of the circuit board, so as to prevent falling solder flux, which has gotten damp, from connecting to different pins of an electronic device or different conductors of signal lines, and direct communication between at least two pins of the electronic device and at least two signal lines due to current leakage is effectively avoided, thereby solving the problems of short-circuiting, signal leakage, etc. In addition, further provided in the present application is an electronic device.

HE BIAOSHENG (CN)

PCT/CN2022/072798

August 11, 2022

January 19, 2022

Click for automatic bibliography generation  

CHIPSEA TECH SHENZHEN CORP (CN)

H05K1/02

CN215420882U	2022-01-04
CN213522495U	2021-06-22
CN206559738U	2017-10-13
CN205071468U	2016-03-02
CN103582292A	2014-02-12
CN101494951A	2009-07-29
US20100206617A1	2010-08-19

SHENZHEN ZHIQUAN INTELLECTUAL PROPERTY OFFICE (CN)

View/Download PDF      PDF Help

Previous Patent: INFRARED TEMPERATURE SENSOR AND ELECTRONIC DEVICE

Next Patent: INFRARED TEMPERATURE SENSOR AND ELECTRONIC DEVICE