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Title:
INFRARED TEMPERATURE SENSOR AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/166589
Kind Code:
A1
Abstract:
Embodiments of the present application provide an infrared temperature sensor and an electronic device. The infrared temperature sensor comprises a substrate, an infrared sensing element, an integrated circuit chip, a thermal insulating member, and a packaging housing. The infrared sensing element is disposed on the substrate. The integrated circuit chip is disposed on the substrate. The infrared sensing element and the integrated circuit chip are spaced apart from and electrically connected to each other. The thermal insulating member is disposed on the substrate and is located between the integrated circuit chip and the infrared sensing element. The packaging housing is disposed on the substrate and packages the infrared sensing element, the integrated circuit chip, and the thermal insulating member. According to the infrared temperature sensor provided by the embodiments of the present application, heat transfer between the circuit chip and the infrared sensing element is isolated by the thermal insulating member, so that the heat generated by the integrated circuit chip after packaging is prevented from affecting the measurement accuracy of the infrared sensing element.

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Inventors:
CHEN HUAHUI (CN)
Application Number:
PCT/CN2022/072801
Publication Date:
August 11, 2022
Filing Date:
January 19, 2022
Export Citation:
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Assignee:
CHIPSEA TECH SHENZHEN CORP (CN)
International Classes:
G01J5/04; G01J5/06
Foreign References:
CN214471356U2021-10-22
CN111637978A2020-09-08
CN108702402A2018-10-23
CN111900244A2020-11-06
CN103403508A2013-11-20
CN212458679U2021-02-02
JP2014098671A2014-05-29
CN205879369U2017-01-11
Attorney, Agent or Firm:
SHENZHEN ZHIQUAN INTELLECTUAL PROPERTY OFFICE (CN)
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