Title:
INK-JET ADHESIVE, METHOD FOR PRODUCING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2022/203033
Kind Code:
A1
Abstract:
Provided is an ink-jet adhesive which, when a transparent member is used as an adherent member, can inhibit a component of the adhesive from adhering to areas of the transparent member which are not intended to be bonded. This ink-jet adhesive comprises a photocurable compound having a (meth)acryloyl group or a vinyl group and having no cyclic ether group and a photopolymerization initiator, and either contains no thermally curable compound having no (meth)acryloyl group and having a cyclic ether group or contains the thermally curable compound. When the ink-jet adhesive contains the thermally curable compound, the content of the thermally curable compound is 5 wt% or less.
Inventors:
SUGISAWA YOSHIFUMI (JP)
WATANABE TAKASHI (JP)
TANIKAWA MITSURU (JP)
FUJITA YUSUKE (JP)
HAMADA TAICHI (JP)
TANAKA TOMOYA (JP)
WATANABE TAKASHI (JP)
TANIKAWA MITSURU (JP)
FUJITA YUSUKE (JP)
HAMADA TAICHI (JP)
TANAKA TOMOYA (JP)
Application Number:
PCT/JP2022/014273
Publication Date:
September 29, 2022
Filing Date:
March 25, 2022
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C09J4/02; C09J4/06; C09J5/00; C09J11/04; C09J11/06; C09J133/00; C09J163/00; G02B5/22; H01L21/52
Domestic Patent References:
| WO2016080069A1 | 2016-05-26 |
Foreign References:
| JP2017066313A | 2017-04-06 | |||
| JP2016147930A | 2016-08-18 | |||
| JP2016065171A | 2016-04-28 | |||
| JP2018067676A | 2018-04-26 | |||
| JP2009231605A | 2009-10-08 |
Attorney, Agent or Firm:
OSAKA FRONT (JP)
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