Title:
INNER SURFACE SHAPE MEASUREMENT APPARATUS, AND ALIGNMENT METHOD FOR INNER SURFACE SHAPE MEASUREMENT APPARATUS
Document Type and Number:
WIPO Patent Application WO/2021/187192
Kind Code:
A1
Abstract:
Provided are an inner surface shape measurement apparatus that suitably aligns the positions of holes, and an alignment method for the inner surface shape measurement apparatus. A first position of a fine hole in a workpiece that is fixed to a direct-acting inclining stage at a first rotational angle of a rotating body and rotates together with the rotating body, and a second position different from the first position, are observed by a camera, and a first position and a second position of the fine hole in the workpiece at a second rotational angle of the rotating body different from the first rotational angle are also observed by the camera. The position and inclination of the fine hole are calculated from the coordinates of each of the observed positions, and fine hole information including the position and inclination of the fine hole is outputted.
Inventors:
MORII HIDEKI (JP)
MORIYAMA KATSUFUMI (JP)
KIMURA HIROAKI (JP)
MORIYAMA KATSUFUMI (JP)
KIMURA HIROAKI (JP)
Application Number:
PCT/JP2021/008943
Publication Date:
September 23, 2021
Filing Date:
March 08, 2021
Export Citation:
Assignee:
TOKYO SEIMITSU CO LTD (JP)
International Classes:
G01B5/20; G01B7/28; G01B11/00; G01B11/24; G01B21/00; G01B21/20
Domestic Patent References:
| WO2016084638A1 | 2016-06-02 |
Foreign References:
| JP2011174779A | 2011-09-08 | |||
| JP2018163093A | 2018-10-18 | |||
| JP2018084488A | 2018-05-31 | |||
| JPH10339623A | 1998-12-22 |
Attorney, Agent or Firm:
MATSUURA, Kenzo (JP)
Download PDF: