Title:
INNER SURFACE SHAPE MEASUREMENT DEVICE, ALIGNMENT METHOD FOR INNER SURFACE SHAPE MEASUREMENT DEVICE, AND MAGNIFICATION CALIBRATION METHOD
Document Type and Number:
WIPO Patent Application WO/2021/187191
Kind Code:
A1
Abstract:
Provided are an inner surface shape measurement device which can properly align the position of a probe, and an alignment method for the inner surface shape measurement device. This inner surface shape measurement device is for measuring an inner surface shape of a small hole H formed in a workpiece W, the device comprising: a rotary body 16 and a direct acting tilt stage 18 for rotating the workpiece W about a rotation axis; an elongated probe 30 which can be inserted into the small hole H of the workpiece; a probe direct acting tilt mechanism 28 which can adjust the orientation of the probe; a camera 32 which is configured to be rotatable integrally with the rotary body 16 and captures an image of the probe 30 from at least three circumferential positions on a rotation trajectory about a rotation axis C; and a control device 50 for adjusting the orientation of the probe through the probe direct acting tilt mechanism 28 on the basis of a captured image captured by the camera 32 at each of the circumferential positions.
Inventors:
MORII HIDEKI (JP)
MORIYAMA KATSUFUMI (JP)
MORIYAMA KATSUFUMI (JP)
Application Number:
PCT/JP2021/008942
Publication Date:
September 23, 2021
Filing Date:
March 08, 2021
Export Citation:
Assignee:
TOKYO SEIMITSU CO LTD (JP)
International Classes:
G01B5/00; G01B5/20; G01B11/00; G01B21/00; G01B21/20
Foreign References:
| JP2018163093A | 2018-10-18 | |||
| JP2011174779A | 2011-09-08 | |||
| JP2008292359A | 2008-12-04 | |||
| US20180096485A1 | 2018-04-05 |
Attorney, Agent or Firm:
MATSUURA, Kenzo (JP)
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