Title:
INSERT-MOLDED ARTICLE, ELECTRICAL SIGNAL CONNECTOR, ENDOSCOPE, AND INSERT MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/154737
Kind Code:
A1
Abstract:
In this insert-molded article, a metal substrate and a resin are joined, the insert-molded article has, between the metal substrate and the resin and in order from the metal substrate side, a base layer, a noble-metal layer, a compound layer comprising a compound including Si and O, and a mixed layer in which the compound and the resin are intermingled, and Ni is present in the compound layer and the mixed layer.
Inventors:
ENDO TETSUYA (JP)
SHIGA NAOHITO (JP)
SHIRAMIZU KOHEI (JP)
NAKAMOTO JUNKO (JP)
SHIGA NAOHITO (JP)
SHIRAMIZU KOHEI (JP)
NAKAMOTO JUNKO (JP)
Application Number:
PCT/JP2017/008323
Publication Date:
September 14, 2017
Filing Date:
March 02, 2017
Export Citation:
Assignee:
OLYMPUS CORP (JP)
International Classes:
B29C45/14; A61B1/00; B32B15/08; H01R13/405
Domestic Patent References:
| WO2013114703A1 | 2013-08-08 |
Foreign References:
| JP2012516022A | 2012-07-12 | |||
| JP2007173224A | 2007-07-05 | |||
| JP2007296769A | 2007-11-15 | |||
| JPH08213070A | 1996-08-20 | |||
| JP2013118174A | 2013-06-13 | |||
| JP5945650B1 | 2016-07-05 |
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
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