Title:
INSOLE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/162973
Kind Code:
A1
Abstract:
[Problem] To provide an insole that fits a buyer's feet easier. [Solution] This insole manufacturing method involves: a first step in which a thermoplastic resin is used that melts at a prescribed temperature and a foot-shape resin unit 12 is formed that has the shape of a foot with a prescribed thickness; a second step in which, after shrink processing has been performed cover the foot-shape resin unit 12 with a film, the foot-shape resin unit covered with the film is vacuum packed in a nylon plastic bag; a third step in which an insole 10 manufactured with the first step and the second step is heated at a prescribed temperature; and a fourth step in which the insole 10 having the foot-shape resin unit 12 melted in the third step is attached to the inside of the user's shoe 2, and the foot-shape resin unit 12 is cured a prescribed time has elapsed during which the user wears the shoe 2.
Inventors:
NAKAGAWA SATOSHI (JP)
Application Number:
PCT/JP2021/027466
Publication Date:
August 04, 2022
Filing Date:
July 26, 2021
Export Citation:
Assignee:
NAKAGAWA SATOSHI (JP)
International Classes:
A43B17/14
Foreign References:
| JP3011472U | 1995-05-30 | |||
| JPS55158902U | 1980-11-15 | |||
| JP2014108567A | 2014-06-12 | |||
| JP2015226484A | 2015-12-17 | |||
| JPS6420804A | 1989-01-24 | |||
| JP2005198921A | 2005-07-28 | |||
| JP2013212335A | 2013-10-17 |
Attorney, Agent or Firm:
UEDA Yoshinobu (JP)
Download PDF:
Previous Patent: RESIST REDISUE REMOVAL LIQUID AND METHOD FOR FORMING SUBSTRATE WITH CONDUCTOR PATTERN USING SAME
Next Patent: PIPE SUPPORT STRUCTURE
Next Patent: PIPE SUPPORT STRUCTURE