Title:
INSPECTION DEVICE SET-UP METHOD AND INSPECTION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/176664
Kind Code:
A1
Abstract:
An embodiment of the present disclosure provides an inspection device set-up method which is a method for setting up an inspection device for inspecting a substrate mounted on a mounting base by contacting a probe onto an electrode pad formed on a chip on the substrate. The set-up method comprises: a step for acquiring a first image including the probe of a probe card attached to the inspection device; a step for calculating, on the basis of probe information including the position of the probe calculated on the basis of the first image, and previously prepared probe information or pad information corresponding to the probe card, first information including the center of gravity and angle of the probe card; a step for acquiring a second image including the electrode pad on the substrate mounted on the mounting base; a step for calculating, on the basis of pad information including the position of the electrode pad calculated on the basis of the second image and previously prepared pad information corresponding to the substrate, second information including the center of gravity of the chip and the angle of the substrate; and a step for outputting the first information and the second information.
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Inventors:
WATANABE SHINJIRO (JP)
Application Number:
PCT/JP2022/004591
Publication Date:
August 25, 2022
Filing Date:
February 07, 2022
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/66
Foreign References:
| JP2005150224A | 2005-06-09 | |||
| JPH09199553A | 1997-07-31 | |||
| JP2014238371A | 2014-12-18 | |||
| JP2003270304A | 2003-09-25 | |||
| JPS60213040A | 1985-10-25 | |||
| JPH01125837A | 1989-05-18 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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