Title:
INSPECTION STRUCTURE AND INSPECTION METHOD
Document Type and Number:
WIPO Patent Application WO/2019/203058
Kind Code:
A1
Abstract:
This inspection structure comprises: an insulation layer (102) formed on a semiconductor substrate (101); a first through hole (103) formed on the insulation layer (102); and a second through hole (104). The second through hole (104) is formed on the insulation layer (102) at a set interval with the first through hole (103). Also comprised are a first electrode part (105) and a second electrode part (106). The first electrode part (105) is formed filling the first through hole (103), and comprises a probing pad that is wider than the opening area of the first through hole (103) on the insulation layer (102). The second electrode part (106) is formed filling the second through hole (104), and comprises a probing pad that is wider than the opening area of the second through hole (104) on the insulation layer (102).
Inventors:
YAMADA YUKI (JP)
NADA MASAHIRO (JP)
NAKAJIMA FUMITO (JP)
MATSUZAKI HIDEAKI (JP)
NADA MASAHIRO (JP)
NAKAJIMA FUMITO (JP)
MATSUZAKI HIDEAKI (JP)
Application Number:
PCT/JP2019/015431
Publication Date:
October 24, 2019
Filing Date:
April 09, 2019
Export Citation:
Assignee:
NIPPON TELEGRAPH & TELEPHONE (JP)
International Classes:
H01L21/66; G01N27/00; G01N27/04
Foreign References:
| JP2003133377A | 2003-05-09 | |||
| JP2000003947A | 2000-01-07 | |||
| JP2010003832A | 2010-01-07 | |||
| JP2003100833A | 2003-04-04 |
Attorney, Agent or Firm:
YAMAKAWA, Shigeki et al. (JP)
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