Title:
INSULATED CIRCUIT BOARD MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/193701
Kind Code:
A1
Abstract:
The present invention provides an insulated circuit board manufacturing method comprising a metal piece arranging step for arranging a metal piece in a circuit pattern shape on a resin material which is to become an insulated resin layer, and a joining step for pressurizing and heating the resin material and the metal piece at least in a stacking direction to join the insulated resin layer and the metal piece together. In the joining step, the metal piece and the resin material are pressurized in the stacking direction by a jig comprising a cushion material disposed on the metal piece side, and a guide wall portion disposed in a position opposing a peripheral portion of the cushion material. During pressurization, the peripheral portion of the cushion material and the guide wall portion are contacted with each other.
Inventors:
SAKANIWA YOSHIAKI (JP)
OHASHI TOYO (JP)
OHASHI TOYO (JP)
Application Number:
PCT/JP2021/012169
Publication Date:
September 30, 2021
Filing Date:
March 24, 2021
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
H01L23/12; H05K3/44
Foreign References:
| JP2018147934A | 2018-09-20 | |||
| US20170144246A1 | 2017-05-25 | |||
| JP2013069767A | 2013-04-18 | |||
| JP2020053650A | 2020-04-02 | |||
| JP2015207666A | 2015-11-19 | |||
| JPH09135057A | 1997-05-20 |
Other References:
See also references of EP 4131356A4
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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