INTERCONNECT-USE ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAME

WIPO Patent Application WO/2011/077886

A1

Provided is a method for producing an interconnect-use electronic component, wherein vertical interconnects and redistribution interconnects which are formed in an additional step in producing a dual face package (DFP) or a wafer level chip size package (WLCSP) are integrated as components, the production steps involved in the above being further simplified to reduce costs. The interconnect-use electronic component is embedded into an electronic device package in which a circuit element comprising a semiconductor chip is disposed and connected to an external electrode via vertical and horizontal interconnects. The electronic component for interconnect comprises: an interconnect substrate having a horizontal interconnect and a vertical interconnect which is connected to the horizontal interconnect and extends vertically therefrom; and a support substrate to which the interconnect substrate having the horizontal and vertical interconnects is bonded with an adhesive which is removable with water.

ISHIHARA MASAMICHI (JP)
ENOMOTO MINORU (JP)
NOMURA SHIGERU (JP)

PCT/JP2010/070920

June 30, 2011

November 24, 2010

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KYUSHU INST TECHNOLOGY (JP)
SEKISUI CHEMICAL CO LTD (JP)
ISHIHARA MASAMICHI (JP)
ENOMOTO MINORU (JP)
NOMURA SHIGERU (JP)

H01L23/12; H05K1/02

WO2009123048A1

2009-10-08

JP2004214645A	2004-07-29
JP2006237521A	2006-09-07
JP2006237634A	2006-09-07

OHKAWA, Yuzuru (JP)
Okawa 譲 (JP)

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