Title:
INTERPOSER AND SEMICONDUCTOR MODULE USING SAME
Document Type and Number:
WIPO Patent Application WO/2012/091140
Kind Code:
A1
Abstract:
Provided is an interposer which, when placed between two heat sources, is capable of more effectively suppressing thermal conduction between the heat sources. An interposer (24) is provided with: a body having a cavity (23) maintained in a vacuum state; insulating layers (22a, 22b) respectively formed in an upper wall (20a) and lower wall (20b) of the body; and heat reflecting layers (21a, 21b) respectively formed on the insulating layers (22a, 22b). The interposer (24) thermally insulates between semiconductor devices (11a, 12a) mounted above and below the interposer.
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Inventors:
BONKOHARA MANABU (JP)
Application Number:
PCT/JP2011/080528
Publication Date:
July 05, 2012
Filing Date:
December 28, 2011
Export Citation:
Assignee:
ZYCUBE CO LTD (JP)
BONKOHARA MANABU (JP)
BONKOHARA MANABU (JP)
International Classes:
H01L23/36; H01L23/32; H01L25/065; H01L25/07; H01L25/18
Foreign References:
| JP2008016599A | 2008-01-24 | |||
| JP2010183324A | 2010-08-19 | |||
| JP2007281043A | 2007-10-25 | |||
| JP2006339352A | 2006-12-14 | |||
| JP2005347390A | 2005-12-15 | |||
| US20090311826A1 | 2009-12-17 |
Attorney, Agent or Firm:
IZUMI, Katsufumi (JP)
Spring Katsufumi (JP)
Spring Katsufumi (JP)
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Claims: