Title:
INTERPOSER STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME
Document Type and Number:
WIPO Patent Application WO/2022/080862
Kind Code:
A1
Abstract:
An electronic device according to an embodiment comprises a first printed circuit board (PCB), a second PCB having a shape corresponding to the first PCB, and an interposer surrounding a space between the first PCB and the second PCB and including a plurality of pads. The interposer includes a first surface in contact with the first PCB, a second surface in contact with the second PCB, a first side surface facing the space, and a second side surface opposite the first side surface, and may include a first point exposed through the second side surface, a second point exposed through either the first side surface or the second side surface, and a heat conduction pattern that is disposed, on the first surface, in a region between the plurality of pads, and connects the first point and the second point.
Inventors:
CHUNG YEONKYUNG (KR)
KIM JICHUL (KR)
PARK JINYONG (KR)
JIN GYEONGMIN (KR)
KIM JICHUL (KR)
PARK JINYONG (KR)
JIN GYEONGMIN (KR)
Application Number:
PCT/KR2021/014133
Publication Date:
April 21, 2022
Filing Date:
October 13, 2021
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K1/11; H04M1/02; H05K1/09; H05K3/34
Foreign References:
| KR20160113690A | 2016-09-30 | |||
| KR20170073478A | 2017-06-28 | |||
| JP2011044512A | 2011-03-03 | |||
| JP2006332325A | 2006-12-07 | |||
| KR100852374B1 | 2008-08-14 |
Attorney, Agent or Firm:
KWON, Hyuk-Rok et al. (KR)
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