Title:
IRREGULAR-SHAPE DIE
Document Type and Number:
WIPO Patent Application WO/2023/090324
Kind Code:
A1
Abstract:
The present invention pertains to an irregular-shape diamond die that is used to produce an irregular shape wire, and that is provided with a processing hole in which a reduction part and a bearing part are provided sequentially from the upstream side in a wire drawing direction. In a cross-section of the bearing part perpendicular to the wire drawing direction, a curve line-shape corner part and a non-corner part disposed at a position different from that of the corner part are provided. The surface roughness of the corner part is greater than that of the non-corner part. The surface roughness Sa of the corner part is at most 0.30 μm, and the surface roughness Sa of the non-corner part is at most 0.20 μm.
More Like This:
| JPS6089915 | [Title of the device] Dice case |
Inventors:
ONO AKIHITO (JP)
KIMURA KOHICHIROH (JP)
SEKI YUICHIRO (JP)
KIMURA KOHICHIROH (JP)
SEKI YUICHIRO (JP)
Application Number:
PCT/JP2022/042424
Publication Date:
May 25, 2023
Filing Date:
November 15, 2022
Export Citation:
Assignee:
ALMT CORP (JP)
International Classes:
B21C3/02
Domestic Patent References:
| WO2017073424A1 | 2017-05-04 | |||
| WO2018123513A1 | 2018-07-05 |
Foreign References:
| JP2017154153A | 2017-09-07 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
Download PDF: