Title:
JET FLOW SOLDERING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/243575
Kind Code:
A1
Abstract:
A jet flow soldering device 100 comprises: a retention tank 110 that retains molten solder; supply ports 125, 135 for supplying the molten solder to a substrate 200; and cooling units 310, 330 that are located on the downstream side of the supply ports 125, 135 in the conveying direction of the substrate 200, that are provided at positions above the storage tank 110, and that supply a gas.
Inventors:
KAWASHIMA YASUJI (JP)
TAGUCHI HIROSHI (JP)
KURAMOTO KYOKO (JP)
HANZAWA HENRI (JP)
KAGAYA TOMOTAKE (JP)
ICHIKAWA HIROKAZU (JP)
SHINOHARA KATSUHIRO (JP)
TAGUCHI HIROSHI (JP)
KURAMOTO KYOKO (JP)
HANZAWA HENRI (JP)
KAGAYA TOMOTAKE (JP)
ICHIKAWA HIROKAZU (JP)
SHINOHARA KATSUHIRO (JP)
Application Number:
PCT/JP2023/021647
Publication Date:
December 21, 2023
Filing Date:
June 12, 2023
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
H05K3/34; B23K1/08
Foreign References:
| JP2004111472A | 2004-04-08 | |||
| JP2002329956A | 2002-11-15 | |||
| JP2001308507A | 2001-11-02 | |||
| JPS61137669A | 1986-06-25 | |||
| JPH09186451A | 1997-07-15 | |||
| JP2020163403A | 2020-10-08 | |||
| JP2000340938A | 2000-12-08 |
Attorney, Agent or Firm:
UMEDA Shinsuke et al. (JP)
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