Title:
JET SOLDERING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/243576
Kind Code:
A1
Abstract:
A solder removal mechanism 520 is provided to remove solder from a transport claw 510 for transporting a substrate 200 to which solder is supplied. The solder removal mechanism includes an abutment body 530 that can be passed relatively in a recess portion 511 of the transport claw 510 or under the transport claw 510.
Inventors:
KAWASHIMA YASUJI (JP)
TAGUCHI HIROSHI (JP)
KURAMOTO KYOKO (JP)
HANZAWA HENRI (JP)
KAGAYA TOMOTAKE (JP)
SHINOHARA KATSUHIRO (JP)
TAGUCHI HIROSHI (JP)
KURAMOTO KYOKO (JP)
HANZAWA HENRI (JP)
KAGAYA TOMOTAKE (JP)
SHINOHARA KATSUHIRO (JP)
Application Number:
PCT/JP2023/021650
Publication Date:
December 21, 2023
Filing Date:
June 12, 2023
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
H05K3/34; B23K1/00; B23K3/00
Foreign References:
| JP2001001134A | 2001-01-09 | |||
| JP2005236066A | 2005-09-02 | |||
| JP2002190666A | 2002-07-05 | |||
| JP2000151090A | 2000-05-30 |
Attorney, Agent or Firm:
UMEDA Shinsuke et al. (JP)
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