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Title:
JOINED ARTICLE AND MEMBER FOR HOLDING WAFER AND STRUCTURE FOR MOUNTING THE SAME, AND METHOD FOR TREATING WAFER
Document Type and Number:
WIPO Patent Application WO/2006/090730
Kind Code:
A1
Abstract:
A joined article, which comprises a plate-shaped ceramic article (3), a ring-shaped member (9) and a cylindrical metal member (7) having one end being joined to the under surface of the above plate-shaped ceramic article (3) via a metal joint (5) and another end being joined to the above ring-shaped member (9), wherein the above cylindrical metal member (7) relieves the stress owing to the difference in the thermal expansion coefficient between the plate-shaped ceramic article (3) and the ring-shaped member (9).

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Inventors:
NAKAMURA TSUNEHIKO (JP)
MAEHARA TATSUYA (JP)
Application Number:
PCT/JP2006/303150
Publication Date:
August 31, 2006
Filing Date:
February 22, 2006
Export Citation:
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Assignee:
KYOCERA CORP (JP)
NAKAMURA TSUNEHIKO (JP)
MAEHARA TATSUYA (JP)
International Classes:
H01L21/683; H01L21/3065; H01L21/31
Foreign References:
JP2002356382A2002-12-13
JPH09262734A1997-10-07
JPS6015305U1985-02-01
Attorney, Agent or Firm:
Kawamiya, Osamu (IMP Building 3-7, Shiromi 1-chome, Chuo-k, Osaka-shi Osaka 01, JP)
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