JOINED STRUCTURE, AND METHOD FOR PRODUCING SAID JOINED STRUCTURE

Title:

JOINED STRUCTURE, AND METHOD FOR PRODUCING SAID JOINED STRUCTURE

Document Type and Number:

WIPO Patent Application WO/2023/282016

Kind Code:

A1

Abstract:

A joined structure that comprises: a wire bundle (12) that has, bundled therein, a plurality of conductive wires (13) that are separated from each other, by an inter-wire coating (14) comprising an insulating resin, and glued together; and a metal member (24) joined to the bundle. The bundle has: a tip section (121) provided on one side of the bundle, in the longitudinal direction (DA); and a tip extension (122) that extends from the tip section towards the other side on the opposite side to the one side in the longitudinal direction. The metal member has a metal member connection section (25) that abuts the tip extension. The plurality of conductive wires are fused and joined to some metal member connection sections at the tip section of the bundle, while remaining adhered to each other by the inter-wire coating at the tip extension section. The inter-wire coating is removed from the tip section of the bundle.

Inventors:

KODA KAZUKI (JP)
SHIRAI HIDEAKI (JP)
SHIMOSAKAMOTO TSUGUYA (JP)

Application Number:

PCT/JP2022/024165

Publication Date:

January 12, 2023

Filing Date:

June 16, 2022

Export Citation:

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Assignee:

DENSO CORP (JP)

International Classes:

H01F5/04; H01F5/00; H01F5/06; H01F27/28; H01R4/02; H01R43/02; H02K15/04

Foreign References:

JP2020535596A	2020-12-03
JP2013016366A	2013-01-24
JP2007299761A	2007-11-15