Title:
JOINT BODY, SEMICONDUCTOR DEVICE EQUIPPED WITH JOINT BODY, AND JOINT BODY PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2023/157795
Kind Code:
A1
Abstract:
A joint body according to the present disclosure is characterized by comprising a metallic member and a resin member to be joined with the metallic member, and is characterized in that: the metallic member has a tree-like structural part on a surface to be joined with the resin member; the diameter of at least a portion of the tree-like structural part is in nanometer order; and the tree-like structural part is impregnated with the resin member. Since this configuration makes it possible to secure a sufficient contact area between the resin member and the nanometer-order tree-like structural part formed on the metallic member, a joint body in which the metallic member and the resin member are firmly joined to each other can be obtained.
Inventors:
KITAGAWA TATSUYA (JP)
Application Number:
PCT/JP2023/004742
Publication Date:
August 24, 2023
Filing Date:
February 13, 2023
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B23K26/352; B29C65/44
Domestic Patent References:
| WO2015087482A1 | 2015-06-18 | |||
| WO2020230200A1 | 2020-11-19 |
Foreign References:
| JP2018067600A | 2018-04-26 | |||
| JP2017130457A | 2017-07-27 |
Attorney, Agent or Firm:
KURATANI, Yasutaka et al. (JP)
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