Title:
PACKAGE SUBSTRATE AND INDUCTOR COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/157796
Kind Code:
A1
Abstract:
A package substrate 200 has an inductor layer 250 that is provided with: a magnetic body part 10 including a first magnetic body layer 11 containing first magnetic particles and a first resin, and a second magnetic body layer 12 disposed on at least one main surface of the first magnetic body layer 11 and containing second magnetic particles and a second resin; and inductor wiring 20 provided inside the first magnetic body layer 11 and functioning as an inductor. The inductor wiring 20 includes a first wire 21 and a second wire 22 disposed adjacent to each other on the same plane along the main surface of the first magnetic body layer 11. The first wire 21 and the second wire 22 are magnetically coupled. The second magnetic body layer 12 is disposed straddling the first wire 21 and the second wire 22 so as to overlap with the first wire 21 and the second wire 22 in the thickness direction. The second magnetic body layer 12 has anisotropic magnetic permeability such that the magnetic permeability in the main surface direction is different from the magnetic permeability in the thickness direction. The magnetic permeability in the main surface direction of the second magnetic body layer 12 is greater than the magnetic permeability in the thickness direction of the second magnetic body layer 12. The magnetic permeability in the main surface direction of the second magnetic body layer 12 is greater than the magnetic permeability in the main surface direction of the first magnetic body layer 11.
Inventors:
NISHIYAMA KENJI (JP)
USHIMI YOSHIMITSU (JP)
HIMEDA KOSHI (JP)
ADACHI NOBUYOSHI (JP)
USHIMI YOSHIMITSU (JP)
HIMEDA KOSHI (JP)
ADACHI NOBUYOSHI (JP)
Application Number:
PCT/JP2023/004746
Publication Date:
August 24, 2023
Filing Date:
February 13, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01F17/04; H01F27/00; H01F27/24; H01F27/28; H05K1/16
Foreign References:
| JP2021028928A | 2021-02-25 | |||
| JP2020161645A | 2020-10-01 | |||
| JP2021057482A | 2021-04-08 | |||
| JP2021163901A | 2021-10-11 | |||
| JP2019125689A | 2019-07-25 | |||
| JP2020170822A | 2020-10-15 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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