Title:
JUMPER CHIP PART
Document Type and Number:
WIPO Patent Application WO/2014/003181
Kind Code:
A1
Abstract:
Provided is a jumper chip part that is unlikely to fracture even when the dimensions are increased. An insulating substrate (3) is composed of a glass-epoxy substrate. A front-surface conductive layer (5) and a back-surface conductive layer (7) are composed of copper foil secured to the front surface (3a) and the back surface (3b) of the insulating substrate (3). A pair of terminal electrodes (9, 11) are formed at the end of the insulating substrate (3), and are electrically connected to the front-surface conductive layer (5) and the back-surface conductive layer (7).
Inventors:
TAKEUCHI KATSUMI
KURIBAYASHI MASAKI
KURIBAYASHI MASAKI
Application Number:
PCT/JP2013/067889
Publication Date:
January 03, 2014
Filing Date:
June 28, 2013
Export Citation:
Assignee:
HOKURIKU ELECT IND (JP)
International Classes:
H01C7/00; H01C13/00; H01C17/00; H01C17/06
Foreign References:
| JP2005079235A | 2005-03-24 | |||
| JP2002324701A | 2002-11-08 | |||
| JP2010062025A | 2010-03-18 | |||
| JP2009194128A | 2009-08-27 |
Attorney, Agent or Firm:
NISHIURA Tsuguharu (JP)
Tsugiharu Nishiura (JP)
Tsugiharu Nishiura (JP)
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