Title:
KIT, UNDERLAYER FILM FORMING COMPOSITION FOR IMPRINTING, LAMINATE, AND PRODUCTION METHOD USING THESE
Document Type and Number:
WIPO Patent Application WO/2019/156008
Kind Code:
A1
Abstract:
A kit having: a curable composition for imprinting, that includes a polymerizable compound having an aromatic ring; and an underlayer film forming composition for imprinting, that includes a polymer and a solvent. The polymer includes at least one type of a specific constituent unit and has a polymerizable group. A film formed from the underlayer film forming composition for imprinting is solid at 23°C and is a continuous partial structure that includes the aromatic ring of the polymerizable compound. A section that occupies at least 60% by mass of the polymerizable compound is common with a continuous partial structure including an aromatic ring included in a substituent R in a side chain in the polymer. The present invention also pertains to: an underlayer film forming composition for imprinting that is used together with the curable composition for imprinting; a laminate; a laminate production method; a cured product pattern production method; and a circuit board production method.
Inventors:
SHIMOJU NAOYA (JP)
SHIBUYA AKINORI (JP)
GOTO YUICHIRO (JP)
HAKAMATA AKIHIRO (JP)
SHIBUYA AKINORI (JP)
GOTO YUICHIRO (JP)
HAKAMATA AKIHIRO (JP)
Application Number:
PCT/JP2019/003767
Publication Date:
August 15, 2019
Filing Date:
February 04, 2019
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C09D133/04; B29C59/02; B32B27/30; C08F20/18; C08F212/08; C08F290/12; C09D5/00; C09D125/02; C09D129/10; C09D145/00; C09D165/00; H01L21/027
Domestic Patent References:
| WO2017170631A1 | 2017-10-05 | |||
| WO2017170697A1 | 2017-10-05 | |||
| WO2016152600A1 | 2016-09-29 | |||
| WO2014097993A1 | 2014-06-26 |
Foreign References:
| JP2014189616A | 2014-10-06 | |||
| JP2017199787A | 2017-11-02 | |||
| JP2016058663A | 2016-04-21 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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