Title:
LAMINATE CURED BODY, PRINTED WIRING BOARD HAVING SAME, AND LAMINATE CURED BODY MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/191037
Kind Code:
A1
Abstract:
[Problem] To provide a laminate cured body, a printed wiring board having the same, and a laminate cured body manufacturing method, wherein, even when a cured body having a large film thickness is manufactured using a photocurable resin composition, excellent curing can be performed also in the bottom portion, thereby suppressing undercut formation and achieving improved adhesion to a substrate. [Solution] Provided are: a laminate cured body for use as a resist for a printed wiring board, the laminate cured body being characterized by comprising a lower-layer cured film made of a photocurable resin composition that has been laminated on a substrate upper surface and photocured, and one or a plurality of upper-layer cured films made of a photocurable resin composition that has been laminated on the lower-layer cured film and separately photocured, the laminate cured body being used as a resist for a printed wiring board; a printed wiring board having the same; and a laminate manufacturing method.
Inventors:
NAKAJIMA KOSUKE (JP)
KOYAMA NAOHITO (JP)
ODAGIRI YUTO (JP)
KOYAMA NAOHITO (JP)
ODAGIRI YUTO (JP)
Application Number:
PCT/JP2023/013508
Publication Date:
October 05, 2023
Filing Date:
March 31, 2023
Export Citation:
Assignee:
TAIYO HOLDINGS CO LTD (JP)
International Classes:
H05K3/28
Foreign References:
| JPH06112632A | 1994-04-22 | |||
| JP2021044387A | 2021-03-18 | |||
| JP2019179201A | 2019-10-17 | |||
| JPH09232741A | 1997-09-05 |
Attorney, Agent or Firm:
ETOH Toshiaki et al. (JP)
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