Title:
LAMINATE, HEAT-DISSIPATING SUBSTRATE, AND LAMINATE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2023/190661
Kind Code:
A1
Abstract:
The laminate (1) has a metal substrate (2) and an inorganic insulating layer (3) in this order in the direction of thickness. The inorganic insulating layer (3) has a first layer (31) and a second layer (32) in this order, each with a different dielectric withstanding voltage and thermal conductivity. The thickness of the inorganic insulating layer (3) is 10 μm or less.
Inventors:
TAKAKURA HAYATO (JP)
ISHIKAWA TAKETO (JP)
ISHIKAWA TAKETO (JP)
Application Number:
PCT/JP2023/012759
Publication Date:
October 05, 2023
Filing Date:
March 29, 2023
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H05K1/05; H05K3/44
Foreign References:
| JPS60245153A | 1985-12-04 | |||
| JPS5815241A | 1983-01-28 | |||
| JPS62122152A | 1987-06-03 | |||
| JPH05251837A | 1993-09-28 | |||
| JPH03119785A | 1991-05-22 | |||
| JPS6130042A | 1986-02-12 | |||
| JPS63205985A | 1988-08-25 |
Attorney, Agent or Firm:
IKUMI PATENT ATTORNEYS OFFICE (JP)
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