Title:
LAMINATE, HEAT-DISSIPATING SUBSTRATE, AND METHOD FOR PRODUCING LAMINATE
Document Type and Number:
WIPO Patent Application WO/2023/190662
Kind Code:
A1
Abstract:
This laminate (1) comprises: a metal substrate (2) including one surface (21) and another surface (22) in the thickness direction, and also including a side surface (23) linking the peripheral edge of the one surface (21) and the peripheral edge of the other surface (22); and an insulation layer (3) disposed on the one surface (21) and the side surface (23) of the metal substrate (2). The side surface (23) includes an inclined surface (23S) that is inclined relative to the thickness direction.
Inventors:
TAKAKURA HAYATO (JP)
ISHIKAWA TAKETO (JP)
TSUNEKAWA MAKOTO (JP)
SAKAKURA TAKATOSHI (JP)
NIINO TEPPEI (JP)
ISHIKAWA TAKETO (JP)
TSUNEKAWA MAKOTO (JP)
SAKAKURA TAKATOSHI (JP)
NIINO TEPPEI (JP)
Application Number:
PCT/JP2023/012760
Publication Date:
October 05, 2023
Filing Date:
March 29, 2023
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B32B15/04; B05D1/18; B05D5/12; B05D7/14; B32B3/02; B32B15/088; B32B15/20; H01L23/36; H05K1/05
Domestic Patent References:
| WO2019177078A1 | 2019-09-19 |
Foreign References:
| JPH06258671A | 1994-09-16 | |||
| JP2019114624A | 2019-07-11 | |||
| JP2004228415A | 2004-08-12 | |||
| JP2008098493A | 2008-04-24 | |||
| JP2022181817A | 2022-12-08 |
Attorney, Agent or Firm:
IKUMI PATENT ATTORNEYS OFFICE (JP)
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