Title:
LAMINATE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2023/238692
Kind Code:
A1
Abstract:
A laminate comprising: a base; and a thermally conductive layer that is provided on the substrate, that includes metal-covered resin particles aligned and spaced apart at a prescribed interval, and that contains a curable component, a curing agent for curing the curable component, thermally conductive particles, and low melting point metal particles, wherein the metal-covered resin particles are in contact with the base, the volume average particle size of the metal-covered resin particles is smaller than the volume average particle size of the thermally conductive particles, and the base contains at least one selected from silicon, aluminum, tungsten, molybdenum, glass, mold resin, stainless steel, and ceramic.
Inventors:
NAGASHIMA MINORU (JP)
NISHIO TAKESHI (JP)
SHIBUYA HIROKI (JP)
IWATA YUKI (JP)
KAWAKAMI RYOKO (JP)
ZHAO YIJING (JP)
NISHIO TAKESHI (JP)
SHIBUYA HIROKI (JP)
IWATA YUKI (JP)
KAWAKAMI RYOKO (JP)
ZHAO YIJING (JP)
Application Number:
PCT/JP2023/019591
Publication Date:
December 14, 2023
Filing Date:
May 25, 2023
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
B32B27/18; B32B7/027; H01L23/36
Domestic Patent References:
| WO2013094613A1 | 2013-06-27 | |||
| WO2020071074A1 | 2020-04-09 | |||
| WO2015146349A1 | 2015-10-01 |
Foreign References:
| JP2016126843A | 2016-07-11 | |||
| JP2007214492A | 2007-08-23 | |||
| JP2017025313A | 2017-02-02 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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