Title:
LAMINATE MOLDING METHOD AND LAMINATE MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/235107
Kind Code:
A1
Abstract:
This laminate molding method is for molding a laminate by melting/solidifying or sintering a powder fed on a stage through application of a beam to the powder, and comprises: a moving distance setting step S22 for setting, as the moving distance of the stage, a length based on the particle size of the powder with a prescribed proportion; and a molding step S24 for molding the laminate by repeatedly performing moving the stage downward by the moving distance, feeding the powder to the moved stage, and melting/solidifying or sintering the powder through application of the beam to the fed powder. This laminate molding method enables suppression of reduction in performance of the laminate.
Inventors:
SHINZAWA KEISUKE (JP)
TAKITA ATSUSHI (JP)
CHIBA AKIHIKO (JP)
TAKITA ATSUSHI (JP)
CHIBA AKIHIKO (JP)
Application Number:
PCT/JP2019/020549
Publication Date:
November 26, 2020
Filing Date:
May 23, 2019
Export Citation:
Assignee:
MITSUBISHI HEAVY IND ENGINE & TURBOCHARGER LTD (JP)
UNIV TOHOKU (JP)
UNIV TOHOKU (JP)
International Classes:
B22F3/105; B22F3/16; B33Y10/00; B33Y30/00
Foreign References:
| JP2019064226A | 2019-04-25 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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