Title:
LAMINATE MOLDING SYSTEM AND LAMINATE MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/176130
Kind Code:
A1
Abstract:
This laminate molding system (11) uses carrier films (F1, F2) to load a to-be-laminate-molded article (A) from one side of a lamination device (12), and unloads a laminate-molded article from the other side of the lamination device (12) after laminate-molding with the lamination device (12), the laminate molding system comprising sagging prevention mechanisms (18a, 18b) which are provided at a loading-side outside adjacent position with respect to a molding position (12a) of the lamination device (12) and at an unloading-side outside adjacent position with respect to the molding position (12a) of the lamination device (12), and which prevent sagging of the carrier film (F1) and the to-be-laminate-molded article (A) at the molding position (12a) of the lamination device (12). Accordingly, the present invention provides a laminate molding system and a lamination molding method with which the problem of causing molding defects due to the sagging of carrier films in a lamination device can be mitigated.
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Inventors:
YAMAMOTO TAKAYUKI (JP)
Application Number:
PCT/JP2023/001205
Publication Date:
September 21, 2023
Filing Date:
January 17, 2023
Export Citation:
Assignee:
JAPAN STEEL WORKS LTD (JP)
International Classes:
B29C43/18; B29C43/34; B29C63/02
Domestic Patent References:
| WO2017010319A1 | 2017-01-19 |
Foreign References:
| JP2020097231A | 2020-06-25 | |||
| JP2014018984A | 2014-02-03 | |||
| JP7025499B1 | 2022-02-24 | |||
| JPH10315257A | 1998-12-02 | |||
| JP2000141389A | 2000-05-23 |
Attorney, Agent or Firm:
IEIRI Takeshi (JP)
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