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Patent Searching and Data


Title:
LAMINATE, PACKAGING MATERIAL, AND PACKAGING BODY
Document Type and Number:
WIPO Patent Application WO/2023/008400
Kind Code:
A1
Abstract:
A laminate having a polypropylene resin film and an inorganic oxide layer, wherein the laminate is characterized in that the water vapor transmission rate is less than 3.0 g/m2/day, the peel strength of the inorganic oxide layer is 0.7 N/15 mm or more, and when the stress at 121ºC in the main orientation axis direction as measured by thermomechanical analysis (TMA) is denoted by SF121ºC and the stress at 145ºC in the main orientation axis direction is denoted by SF145ºC, said laminate satisfies SF145ºC - SF121ºC ≤ 2.50 MPa. The present invention provides a laminate that is suitable for use in applications in which processing and use in a high-temperature environment are required and there is a need to reduce the effects of moisture.

Inventors:
AONO HARUKI (JP)
IMANISHI YASUYUKI (JP)
OHKURA MASATOSHI (JP)
Application Number:
PCT/JP2022/028693
Publication Date:
February 02, 2023
Filing Date:
July 26, 2022
Export Citation:
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Assignee:
TORAY INDUSTRIES (JP)
International Classes:
B32B9/00; B32B27/32; B65D65/40
Domestic Patent References:
WO2017221781A12017-12-28
WO2011156053A12011-12-15
WO2022138531A12022-06-30
WO2022019192A12022-01-27
WO2017221781A12017-12-28
Foreign References:
JP2000108262A2000-04-18
JP2001225409A2001-08-21
JPH10249989A1998-09-22
JP2022035487A2022-03-04
JP2007105893A2007-04-26
JP2021020391A2021-02-18
Other References:
"Kobunshi Hyomen Kakogaku", POLYMER SURFACE PROCESSING, pages 118 - 119
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