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Title:
LAMINATE PRODUCTION METHOD, SEMICONDUCTOR ELEMENT PRODUCTION METHOD, AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2017/209176
Kind Code:
A1
Abstract:
A laminate production method which can suppress delamination of a laminate comprising a substrate, a cured layer and a metal layer; a semiconductor element production method; and a laminate are provided. This laminate production method involves, in order: a photosensitive resin composition layer forming step for applying a photosensitive resin composition to the substrate and forming into a layer shape; an exposure step for exposing the photosensitive resin composition layer applied to the substrate; a development processing step for performing development processing on the exposed photosensitive resin composition layer; a curing step for curing the photosensitive resin composition layer after developing; and a metal layer forming step for forming a metal layer, with gas phase film formation, on the surface of the photosensitive resin composition layer after the curing step, wherein the temperature of the photosensitive resin composition layer after the curing step when forming the metal layer is less than the glass transition temperature of the photosensitive resin composition layer after the curing step.

Inventors:
INUJIMA TAKAYOSHI (JP)
FUKUHARA KEI (JP)
VANCLOOSTER STEFAN (BE)
ITO KATSUYUKI (JP)
Application Number:
PCT/JP2017/020249
Publication Date:
December 07, 2017
Filing Date:
May 31, 2017
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/40; G03F7/037; G03F7/20; G03F7/38; H01L21/312; H01L25/065; H01L25/07; H01L25/18
Foreign References:
JP2000343031A2000-12-12
JP2013543650A2013-12-05
JP2004103488A2004-04-02
JP2000026722A2000-01-25
JP2008222937A2008-09-25
JP2012516927A2012-07-26
Other References:
EIJI MAKINO, TAKAYUKI SHIBATA, YOSHIHIKO YAMADA: "Polyimide Resist for Photoezching of Fine Ceramics in Hot Phosphoric Acid", THE JOURNAL OF THE SURFACE FINISHING SOCIETY OF JAPAN, vol. 49, no. 6, 9 March 1998 (1998-03-09), pages 637 - 642, XP055599681
Attorney, Agent or Firm:
SIKS & CO. (JP)
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