Title:
CURED FILM PRODUCTION METHOD, LAMINATE PRODUCTION METHOD, AND SEMICONDUCTOR ELEMENT PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2017/209177
Kind Code:
A1
Abstract:
A cured film production method which can suppress warpage of the substrate of a laminate comprising a substrate and a cured film; a laminate production method which can suppress delamination of a laminate comprising a substrate, a cured layer and a metal layer; and a semiconductor element production method are provided. This laminate production method involves, in order: a photosensitive resin composition layer forming step for applying a photosensitive resin composition to the substrate and forming into a layer shape; an exposure step for exposing the photosensitive resin composition layer; a development processing step for performing development processing on the exposed photosensitive resin composition layer; and a curing step for curing the photosensitive resin composition layer after the development processing, wherein the curing step involves a heating step for heating the photosensitive resin composition layer to a temperature greater than or equal to the glass transition temperature, and a cooling step for cooling the photosensitive resin composition layer after the heating step at a cooling speed of no more than 2°/min.
Inventors:
INUJIMA TAKAYOSHI (JP)
FUKUHARA KEI (JP)
VANCLOOSTER STEFAN (BE)
ITO KATSUYUKI (JP)
FUKUHARA KEI (JP)
VANCLOOSTER STEFAN (BE)
ITO KATSUYUKI (JP)
Application Number:
PCT/JP2017/020250
Publication Date:
December 07, 2017
Filing Date:
May 31, 2017
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/40; C08G73/10; C08G73/22; G03F7/037; G03F7/20; H01L21/56
Foreign References:
| JP2008076583A | 2008-04-03 | |||
| JPH03136231A | 1991-06-11 | |||
| US9159547B2 | 2015-10-13 | |||
| JPS6167224A | 1986-04-07 | |||
| JP2007052220A | 2007-03-01 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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