LAMINATE STRUCTURE, DRY FILM, AND FLEXIBLE PRINTED WIRING BOARD

Title:

LAMINATE STRUCTURE, DRY FILM, AND FLEXIBLE PRINTED WIRING BOARD

Document Type and Number:

WIPO Patent Application WO/2016/060237

Kind Code:

A1

Abstract:

The present invention provides: a laminate structure and dry film having excellent flexibility and being suitable for an insulating film of a flexible printed wiring board, particularly for a collective formation process of a bending portion (bent portion) and mounting portion (unbent portion); and a flexible printed wiring board having a cured product of said dry film as a protective film. Provided is a laminate structure having a resin layer (A) and a resin layer (B) that is laminated on the flexible printed wiring board with the resin layer (A) interposed therebetween. The resin layer (B) comprises a photosensitive thermosetting resin composition including an alkali-soluble resin, a photopolymerization initiator, and a heat-reactive compound, and the resin layer (A) comprises an alkali-developable resin composition including an alkali-soluble resin and a heat-reactive compound but not including a photopolymerization initiator.

Inventors:

MIYABE HIDEKAZU (JP)
HAYASHI MAKOTO (JP)
ODAGIRI YUTO (JP)
KOIKE NAOYUKI (JP)

Application Number:

PCT/JP2015/079291

Publication Date:

April 21, 2016

Filing Date:

October 16, 2015

Export Citation:

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Assignee:

TAIYO INK MFG CO LTD (JP)

International Classes:

G03F7/11; G03F7/004; H05K3/28

Domestic Patent References:

WO2013099885A1	2013-07-04
WO2013171888A1	2013-11-21
WO2014171525A1	2014-10-23

Foreign References:

JP2009048170A	2009-03-05
JP2007310201A	2007-11-29
JP2010204174A	2010-09-16
JP2004145013A	2004-05-20
JP2004140313A	2004-05-13
JP2010032743A	2010-02-12
JP2015155199A	2015-08-27
JP2015173153A	2015-10-01