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Title:
LAMINATE
Document Type and Number:
WIPO Patent Application WO/2022/102778
Kind Code:
A1
Abstract:
A laminate comprising a silicone layer and a polyimide layer, wherein the weight reduction rate of the silicone layer at 380°C, measured by thermogravimetry, is no more than than 9 mass%.

Inventors:
TANIYAMA KAORI (JP)
MATSUI JUN (JP)
HAMA YOSUKE (JP)
Application Number:
PCT/JP2021/041955
Publication Date:
May 19, 2022
Filing Date:
November 15, 2021
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Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
B32B27/00; B32B7/02; B32B27/34; C08K3/013; C08L83/04; C23C26/00
Domestic Patent References:
WO2017073507A12017-05-04
WO2017195711A12017-11-16
WO2018016564A12018-01-25
Foreign References:
JP2017214501A2017-12-07
JP2020136600A2020-08-31
JP2018053260A2018-04-05
JP2015170690A2015-09-28
JP2012077128A2012-04-19
JP2017100397A2017-06-08
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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