LAMINATED CIRCUIT BOARD AND PRODUCTION METHOD FOR ELECTRONIC PART, AND LAMINATED ELECTRONIC PART

Title:

LAMINATED CIRCUIT BOARD AND PRODUCTION METHOD FOR ELECTRONIC PART, AND LAMINATED ELECTRONIC PART

Document Type and Number:

WIPO Patent Application WO/2002/054420

Kind Code:

A1

Abstract:

A laminated circuit board capable of being made thinner than conventional circuit boards and not posing a strength problem during handling, and a production method for an electronic part, and a laminated electronic part obtained by this method, wherein a conductor layer is bonded to a transfer film and patterned into a specified pattern, then the transfer film having pattern-formed conductor layer is disposed to face prepreg on its conductor layer side thereof, and the transfer film is press-bonded by heating in a prepreg direction and then is peeled off to obtain a prepreg having a conductor layer and constituting the laminated circuit board.

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Inventors:

TAKAYA MINORU (JP)
ENDO TOSHIKAZU (JP)
SASAKI MASAMI (JP)

Application Number:

PCT/JP2001/011499

Publication Date:

July 11, 2002

Filing Date:

December 27, 2001

Export Citation:

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Assignee:

TDK CORP (JP)
TAKAYA MINORU (JP)
ENDO TOSHIKAZU (JP)
SASAKI MASAMI (JP)

International Classes:

H01F17/00; H01F41/04; H01G4/30; H05K1/16; H05K3/20; (IPC1-7): H01F41/04; H01F17/00; H01G4/30

Foreign References:

JPH11251142A	1999-09-17
JP2000058362A	2000-02-25
JP2001347600A	2001-12-18

Other References: