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Title:
LAMINATED SUBSTRATE USING FIBER-REINFORCED THERMOPLASTIC PLASTIC, AND MOLDED PRODUCT MANUFACTURING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2015/083820
Kind Code:
A1
Abstract:
Provided is a laminated substrate wherein a sheet-shaped material with a porosity of 50-99% is laminated onto at least one surface of a prepreg substrate which includes a reinforcing fiber and a thermoplastic resin.

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Inventors:
ISHIKAWA TAKESHI (JP)
OGASAWARA HAYATO (JP)
TOMIOKA MASAO (JP)
Application Number:
PCT/JP2014/082242
Publication Date:
June 11, 2015
Filing Date:
December 05, 2014
Export Citation:
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Assignee:
MITSUBISHI RAYON CO (JP)
International Classes:
B32B5/24; C08J5/04; C08J9/36
Domestic Patent References:
WO2012165418A12012-12-06
Foreign References:
JPH0797465A1995-04-11
JPH07164439A1995-06-27
JP2008194761A2008-08-28
JP2013049150A2013-03-14
JP3977565B22007-09-19
JP4121833B22008-07-23
JP4242644B22009-03-25
Other References:
See also references of EP 3078485A4
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
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