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Patent Searching and Data


Title:
LAMINATION DEVICE, LAMINATION METHOD, AND MOLDED ARTICLE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2023/188715
Kind Code:
A1
Abstract:
In conventional lamination methods, it was difficult to achieve both removal of air bubbles and followability of embedded material. A lamination method for a lamination device having a first chamber and a second chamber in which an air flow within the chamber is blocked by a thin film member, a substrate material and a film material being transported in a superimposed state between a first press plate and the thin film member, wherein the lamination method includes implementing a pressurization step (S3) for depressurizing the first chamber and pressurizing the second chamber to press the film material against the substrate material using the thin film member, a pressing step (S4, S5) for pressurizing in a direction in which the substrate material and the film material are sandwiched between the first press plate and a second press plate to mold a molded article, and a detachment step (S6) for pressurizing the first chamber and depressurizing the second chamber to detach the thin film member from the molded article.

Inventors:
UEDA NAOKI (JP)
YAMAMOTO TAKAYUKI (JP)
KIKUGAWA MASAYUKI (JP)
Application Number:
PCT/JP2023/001458
Publication Date:
October 05, 2023
Filing Date:
January 19, 2023
Export Citation:
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Assignee:
JAPAN STEEL WORKS LTD (JP)
International Classes:
B29C51/10; B29C43/18; B29C43/56; B29C43/58; B29C51/28; B29C51/42; B29C51/46; B29C65/02; B29C65/20
Domestic Patent References:
WO2021024763A12021-02-11
Foreign References:
JPH08183094A1996-07-16
JP2020082616A2020-06-04
Attorney, Agent or Firm:
IEIRI Takeshi (JP)
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