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Title:
ADHESIVE TAPE AND PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/188714
Kind Code:
A1
Abstract:
An adhesive tape having a structure in which a base material layer, a protective layer, and an adhesive layer are laminated in the stated order, the base material layer containing an ionomer resin, the adhesive layer containing a (meth)acrylic polymer A and a photopolymerization initiator, and the acid value of the adhesive layer being 10 mg KOH/g or greater.

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Inventors:
KIMOTO YUKI (JP)
TANAKA SHIGERU (JP)
NOGAMI HIROKO (JP)
HASUMI MIZUKI (JP)
Application Number:
PCT/JP2023/001444
Publication Date:
October 05, 2023
Filing Date:
January 19, 2023
Export Citation:
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Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C09J11/06; C09J7/22; C09J7/29; C09J7/38; C09J133/04; H01L21/301
Domestic Patent References:
WO2016056269A12016-04-14
Foreign References:
JP2015109436A2015-06-11
JP2007053325A2007-03-01
JP2012136632A2012-07-19
JP2004300405A2004-10-28
KR20150059242A2015-06-01
CN101191041A2008-06-04
JP2010129865A2010-06-10
JP2022095302A2022-06-28
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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