Title:
LASER 3D PROCESSING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2018/004123
Kind Code:
A1
Abstract:
The present invention relates to a laser 3D processing system and, more specifically, to a laser 3D processing system which is capable of patterning, cutting, marking, milling or welding while scanning an object for dental prostheses. The laser 3D processing system of the present invention has the effect of improving a processing rate by several tens of times to several hundreds of times since the system adopts a laser scan scheme of forming a line beam on the object by including a reflection mirror without a laser head. That is, transporting a light reflective mirror of several tens of grams instead of a heavy head can reduce the inertia by several tens of times to several hundreds of times, thereby improving the processing rate by several tens of times or more and implementing high-speed and high-precision curves and 3D processing.
Inventors:
LEE SEAKJOON (KR)
Application Number:
PCT/KR2017/004732
Publication Date:
January 04, 2018
Filing Date:
May 07, 2017
Export Citation:
Assignee:
LEE SEAKJOON (KR)
International Classes:
A61C13/00; A61C1/00; A61C9/00
Foreign References:
| KR20150057522A | 2015-05-28 | |||
| JP2005254618A | 2005-09-22 | |||
| KR101026356B1 | 2011-04-05 | |||
| JP2007290024A | 2007-11-08 | |||
| KR101653524B1 | 2016-09-01 |
Attorney, Agent or Firm:
PARK, Junghak (KR)
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